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Mechanical properties of porcelain fused gold alloy containing indium, tin and copper

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³²»ó¿ë ( Nam Sang-Yong ) - ´ë±¸º¸°Ç´ëÇÐ Ä¡±â°ø°ú
ÀÌ´ö¼ö ( Lee Deok-Su ) - ´ë±¸º¸°Ç´ëÇÐ Ä¡±â°ø°ú
°ûµ¿ÁÖ ( Kwak Dong-Ju ) - ´ë±¸º¸°Ç´ëÇÐ Ä¡±â°ø°ú

Abstract


This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker¡¯s hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

Å°¿öµå

Microhardness; bonding strength; Au-Pd-Ag-Sn alloy; Au-Pd-Ag-Cu alloy

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